Mechanical Engineering Intern (Summer 2020)Apply Now
Country:United States of America
Location:HIA32: Cedar Rapids, IA 400 Collins Rd NE , Cedar Rapids, IA, 52498-0505 USA
Collins Aerospace is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry. Created in 2018 by bringing together Rockwell Collins and UTC Aerospace Systems, Collins Aerospace has the capabilities, comprehensive portfolio and expertise to solve customers’ toughest challenges and to meet the demands of a rapidly evolving global market.
We’re looking for a highly motivated candidate to be a Mechanical Engineering Intern within the Mission Systems Communication Products Mechanical Design group. This group is responsible for the mechanical design and electronics packaging of radio and data link products within the Mission Systems Communication Systems directorate.
This position is for a Mechanical Engineering Internship student with interests in applying their skills in the Mission Systems Communication Products Mechanical Design group. This position is for the summer 2020 session located in Cedar Rapids, Iowa. This position provides the opportunity for the student to broaden their background with a practical approach to engineering. The primary goal for the student is to merge their theoretical knowledge gained in school with practical engineering applications in electronics packaging design and development of communication and data link products for ground, shipboard and airborne applications.
The types of responsibilities include collaborating with Mechanical Engineers in the design and development of electronics packaging products and technologies. This position offers the opportunity to expand the student's knowledge and skills in a wide variety of mechanical engineering principles and techniques, including: supporting printed circuit card layouts, preliminary / detailed design in consideration of structural design, thermal, vibration, other environmental factors, prototype build & evaluation, qualification testing, factory transition, and manufacturing support.
Experience / knowledge in the following technical areas are desired:
Electronics design and manufacturing assembly
Geometric dimensioning and tolerancing
Working knowledge of mechanical 3D CAD and analysis tools, such as ANSYS
Proficiency in MS Office (or similar) products
Candidates must be motivated to learn new technologies and apply design techniques to critical military communication products, be a strong team player, and contribute to a positive work environment. A successful candidate will also have the ability to effectively communicate in a professional manner and produce effective, clear and concise technical documentation.
Collins Aerospace is an equal opportunity employer committed to building a diverse global culture that values teamwork, integrity, innovation, leadership, and an unwavering commitment to our customers.
Requires a High School Diploma or equivalent, and student must be pursuing a Bachelors or advanced degree in applicable Engineering discipline.
Must be capable of obtaining a U.S. DoD Secret Clearance. U.S. Citizenship is required.
At Collins, the paths we pave together lead to limitless possibility. And the bonds we form – with our customers and with each other -- propel us all higher, again and again.
Apply now and be part of the team that’s redefining aerospace, every day.
United Technologies Corporation is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.
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Note to candidates regarding interview scams: We'd like to make it clear that UTC Aerospace Systems never asks candidates for money. If you've been approached with a job offer that you suspect may be fraudulent, we strongly recommend you do not respond, send money or personal information. Please report any suspicious activity to Talent Acquisition.
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